IKo Twin-Station

Powerful Simultaneous Processing

 

SUMMARY

The IKo™ TWIN-STATION™ is a self-contained, complete plating system with two entirely separate IKo™ CLASSIC modules for MEMS and NANO fabrication,including wafer installation, cleaning and activation with DI rinsing and Nitrogen gun section.

Easily retrofitted in a cleanroom environment.

System Features

The IKo™ TWIN-STATION contains all accessories for simultaneous processing 2 wafers with two different electroplating applications under one hood. The unit is fabricated with PVC and polypropylene and a minimum of metal parts to avoid potential contamination of electroplating solutions. Metal features are stainless and titanium. All parts can be easily disassembled for maintenance.

The station’s unique arrangement for substrate preparation, specialized wafer holders, reciprocating anodes, programmable reverse pulse rectifiers and pumps ensure surpassing performance:

The unit is designed so that each anode/wafer holder set can be individually operated in a dedicated IKoCLASSIC module without interrupting the processing of the other.

  • Wafer holders, ergonomically designed for easy processing and handling. A full-circle, elastic electric gasket/contact provides uniform current distribution. Result: uniform thickness features across the wafer without leaking solution to the back of the wafer.
  • Reciprocating anodes, a proprietary feature, provide for an efficient exchange of matter and uniform electric field distribution for a wide range of substrate sizes and shapes. 
  • Programmable reverse-pulse rectifiers contribute to equipment versatility with independent operating variable selection
  • Fan-out pumps with constant filtration (regardless of fine filter medium) provide a constant flow of high-quality bulk solution.
      TECHNICAL SPECIFICATIONS
      input power: 220/120 VAC +/-10%, 50-60 Hz, single phase, 15/30 A
      hood size: 7’ W x 3’ D x 6’ H (construction material – Polypropylene)
      wafer size: 2cm2 to 8″
      metals plated: Cu, Ni, Pd, Au, Sn, Pb, Pt, Fe, Ag, Permalloy, Sn/Pb, Pd/Ni and others
       

       

      2 Programmable Reverse Pulse Power Supplies

      current avg: 0.1 A, 1 A, 3 A, 5 A, 10 A
      current peak: 0.3 A, 3 A, 6 A,10 A, 20 A
      volts: 0-10 V (higher voltages available)
      programmable timer: 4 digit realtime
       

       

      Electroplating Section

      anode insoluble: two any size and shape from 2 cm2 up to 8″ FIBRoplate™ anode
      anode soluble: two any size and shape FIBRoplate™ baskets
      wafer holder:

      two any size and shape from 2cm2 up to 8″ full circle gasket/contact, current collector

      filtration: 2 continuous-cartridge, 400 GPH, 1 µ, filter systems
      reciprocating frequency: 2 Independently controlled, 0 – 2.7 Hz
      solution volume: Two 8 liter/2.1 Gal tanks
       

       

      Accessories

      rinse tank: 10″ x 12″ x 12″, cascade flow
      conditioning tank: 10″ x 10″ x 12″, two sections
      ref. electrode: Ag/AgCl or calomel
      add’l feature: two Luggin capillary attachments
      N2/DI: Air/Nitrogen guns and DI water spray handy for wafer processing
      spill prevention Solution containment tray for spill prevention
      SUPPORT

      ECSI provides operating and maintenance manual and initial technical assistance and training as specified bellow:

      a. Free of charge training at the Buyer’s location for first two (2) days;

      b. Travel, room and board expenses paid by the Buyer for the first 2 (two) days at the Buyer’s location;

      c. At the prevailing hourly rate for any additional day beyond 2 (two) initial days.

      Click here to submit a Support Request

      CORE BENEFITS

      Superior process control for mil size and nano structures

      Low purchase and operating costs

      Simultaneously processing 2 wafers of any size & shape (2 cm^2 to 8")

      Identical hydrodynamics for all sizes and shapes if needed

      Two wafer cleaning and plating preparation sections

      }

      Extremely fast (~1µ per minute)

      Uses off-the-shelf chemistries with minimal additives

      Efficiently reuses chemical solution

      Micro/macro uniformity less than 5% across the wafer

      Easy to use and maintain

      IKo Models

      IKo Classic

      The original. The IKo Classic is a practical benchtop tool with the smallest footprint for up to 8" wafers on the market.

      IKo Jr.

      Designed for fast electroplating of high-resolution interconnects and fine metallic features on wafers and substrates.

      IKo Slim

      The Slim version of IKo™ enables fitting up to 3 modules in a fume hood for multiple simultaneous sites within a single station.

      IKo Station

      Designed to be the all-in-one solution. Contains all accessories for processing wafers under one hood. 

      IKo Twin-Station

      Double the power.
      Simultaneous processes 2 wafers with 2 different electroplating applications under one hood. 

      MU-IKo Station

      A self-contained multi-user complete plating system with three entirely separate IKo™ CLASSIC modules

      Ready to Invest In Your R&D?