The IKo™ Station contains all accessories for processing wafers under one hood. The unit is fabricated with PVC and polypropylene and a minimum of metal parts to avoid potential contamination of electroplating solutions. Metal features are stainless and titanium. All parts can be easily disassembled for maintenance.

Dual power supply for precision reverse pulse plating or potentiostatic operation.

IKoStation’s arrangement of wafer holder, reciprocating anode, reverse pulse rectifier and pump ensure surpassing performance:

• Wafer holders, ergonomically designed for easy processing and handling. A full-circle, elastic electric gasket/contact provides uniform current distribution. Result: uniform thickness features across the wafer without leaking solution to the back of the wafer. 
• Reciprocating anode, a proprietary feature. Provides for an efficient exchange of matter and uniform electric field distribution. 
• Reverse-pulse rectifier combined with the potentiostat, contribute to equipment versatility. Reverse-pulse current during processing efficiently controls plating thickness distribution along the Z-axis. Potentiostat enables electroplating at precisely-selected potential for specific MEMS and NANO structures. 
• Fan-out pump with constant filtration (regardless of fine filter medium). Provides a constant flow of high-quality bulk solution.

ECSI provides operating and maintenance manual and initial technical assistance and training as specified bellow:

a. Free of charge training at the Buyer’s location for first two (2) days;

b. Travel, room and board expenses paid by the Buyer for the first 2 (two) days at the Buyer’s location;

c. At the prevailing hourly rate for any additional day beyond 2 (two) initial days.

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