Contamination Resistant
IKo™ Jr. is fabricated with PVC and polypropylene and a minimum of metal parts to avoid potential contamination of electroplating solutions. 

Reliable Parts and Easy Assembly
Metal features are stainless and titanium. All parts can be easily disassembled for maintenance.

The unit is made up of two sections:

1. Electroplating Section
Conveniently accessible while preparing wafers for plating. 

2. Power Section
Rolls over the Electroplating Section for processing. IKo’s arrangement of wafer holder, reciprocating anode, reverse pulse rectifier and pump ensure surpassing performance:

• Wafer holder, ergonomically designed for easy processing and handling. IKo™ can accommodate various wafer sizes. A full-circle, elastic electric contact provides uniform current distribution. Result: uniform thickness features across the wafer.
• Reciprocating anode, a proprietary feature that provides an efficient exchange of matter and uniform electric field distribution.
• Programmable Reverse-pulse Rectifier, contributes to equipment versatility. Reverse-pulse current during processing efficiently controls plating thickness distribution along the Z-axis.
• Fan-out Pump with constant filtration (regardless of fine filter medium). Provides a constant flow of high-quality bulk solution.

ECSI provides operating and maintenance manual and initial technical assistance and training as specified bellow:

a. Free of charge training at the Buyer’s location for first two (2) days;

b. Travel, room and board expenses paid by the Buyer for the first 2 (two) days at the Buyer’s location;

c. At the prevailing hourly rate for any additional day beyond 2 (two) initial days.

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