Meet ECSI
WHO WE ARE
ECSI Fibrotools, Inc. is a small electrochemical engineering company located in Raleigh, NC.
We specialize in manufacturing benchtop electroplating machines for micro and nano structures for MEMS applications. We take pride in building the best electroplating equipment possible and providing superior support, knowledge and customer service to help our customers achieve their goals. Our clients rest easy knowing we are just a phone call away, eager and willing to assist them with whatever their needs may be.
HISTORY
In 1993, our President and CEO, Dr. Igor Kadija, had an idea that would turn the electroplating industry on its head. He believed that a mechanical method could be used to ensure uniform and efficient deposition of metals to the substrate instead of the traditional liquid method that is difficult to control.
Dr. Kadija took his 20+ years of experience in electrochemical engineering and 60+ patents in the field to start his first company, ElectroChemical Systems, inc.
Within a few months, he turned that idea into a reality with Fibrotools™ technology and the IKo family of benchtop electroplating machines.
Two years later after selling 100s of IKos and perfecting that method of electroplating, Dr. Kadija had another burst of inspiration. He envisioned new ways of applying the Fibrotools™ technology and expanding its capabilities to break the chains that traditional electroplating techniques had on users and substrates.
In 2016, he changed the name of the company to ECSI Fibrotools, Inc., as a nod to the old name and a focus on the Fibrotools™ technology, and began work on his biggest challenge/breakthrough /discovery/project yet.
That year, the technology behind our Contact Electroplating Technology, better knows as CET, was first developed.
As the demand for IKo benchtop electroplating machines increased and the development of CET began heating up, Dr. Kadija knew he needed to expand the company. He brought Christine Montella, our current COO, on to the team in 2017, allowing him to focus on bringing CET to fruition. The US patent for CET was granted in late 2018 and the first prototype was build shortly thereafter. 2018 also marked the sale of the first IKo machine in Australia, meaning that there was finally an IKo machine on every continent except Antarctica (for now!).
Two years later after selling 100s of IKos and perfecting that method of electroplating, Dr. Kadija had another burst of inspiration. He envisioned new ways of applying the Fibrotools™ technology and expanding its capabilities to break the chains that traditional electroplating techniques had on users and substrates.
Dr. Igor V. Kadija has spent 30 years in the highly specialized fields of electrochemistry and physicochemical hydrodynamics. He now brings their relevant applications to the manufacturing of semiconductors, MEMS and HDI-PCBs.
Author of numerous articles and presentations and over 60 U.S. and foreign patents. Founded ECSI in 1989.
As the individual with the best first-hand insight and understanding of wet processing of fine features, Dr. Kadija works closely with clients to ensure the best product fit and the highest level of FIBRotools productivity.
Electrochemistry
ECSI Fibrotools makes tools that work.
We design, build and supply practical, precise, wet processing equipment for micromachine and nano-features R&D and manufacturing.
FIBRotools™ are ideally suited for semiconductor, MEMS and advanced electronic packaging markets.
Flexible and adaptable to many different process configurations, FiBRotools™ enables fast track R&D in design advancements of a wide variety of MEMS, NANO, and HDI devices.
Our objective is to make wet processing easy. We liberate our customers from the relative haphazardness of conventional systems.
What enables us to do this is our proprietary FiBRotools™ — Fiber-Initiated Boundary-layer Removal — technology. FiBRotools™ is based on discoveries by our founder and CEO, Igor V. Kadija, in the physicochemical hydrodynamics of wet processing.
FiBRotools™ is covered by four U.S. Patents with worldwide patent coverage.